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CSPT 2023

大會(huì)概覽

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18

The 21st China Semiconductor Packaging and Testing Technology &

Market Annual Conference 2023

Agenda

Conference Overview

DATE TIME EVENT VENUE

Oct. 24th 08:00-18:00 Special Exhibition Set-up Kunshan Ballroom 2-3, 3F

Oct. 25th

10:00-21:00 Registration Lobby, 1F

15:00-17:30 Council Meeting (Members only) International Hall 3, 7F

15:00-21:00 Exhibition Set-up Kunshan Ballroom 2-3, 3F

Oct. 26th

09:00-18:10 Theme Forum Kunshan Ballroom 1, 3F

09:00-18:00 Exhibition Kunshan Ballroom 2-3, 3F

18:15-20:30 Welcome Dinner 6F, Fengle Jun

Oct. 27th

09:00-16:55

Session I: Innovation and Opportunities in

Packaging Testing and Process Equipment International Hall 1, 7F

09:00-17:05

Session Ⅱ: Innovation and Cooperation of

Key Advanced Packaging Materials International Hall 2, 7F

09:00-17:05

Session III: Automotive Electronic Chips

and Power Compound Semiconductor

Packaging and Testing Technology

International Hall 3, 7F

Session IV: Advanced Packaging and

Testing Technology International Hall 3, 7F

13:30-17:00 Session V: Henkel Forum Exhibition Hall 2, 8F

09:00-17:00 Exhibition Kunshan Ballroom 2-3, 3F

※This agenda is for referencethe final will change accordingly.

19

Theme Forum

Oct. 26th 09:00-18:10 Venue: Kunshan Ballroom 1, 3F

Moderator：Dongmei XU, Secretary-General of CSIA, Packaging & Testing Branch

Opening Ceremony

09:00-09:30 Welcome Addresses

Shengli XIAO, Honorary Chairman of CSIA, Packaging & Testing Branch

Yuanchao LIU, Vice Chairman of CSIA

Wei ZHOU, Member of the Standing Committee of the Suzhou Municipal Committee,

Jiangsu Province. Secretary of the Kunshan Municipal Party Committee

Tianchun YE, Secretary General of ICIA, Academician of IEAS

Shaojun WEI, Professor of Tsinghua University, Academician of the International

Eurasian Academy of Sciences, Vice President of CSIA

09:30-09:50 Current Status and Outlook of China Semiconductor Packaging and Testing Industry

Aimo XIAO, Rotating Chairman of CSIA, Packaging & Testing Branch

09:50-10:10 Several New Advances in the Third Generation Semiconductor

Yue HAO, Academician of CAS Member，Director of Information Science Department

of National Natural Science Foundation of China

10:10-10:30 Networking Break

Keynote Speech

10:30-10:45 Building an Advanced Semiconductor Manufacturing Big Data System

Zhinong LIU, EVP of Unisoc (Shanghai) Technologies Co., Ltd

10:45-11:00 Laser Application and Challenges in Semiconductor Advanced

Heterogeneous Packaging

Desmond Hor, VP of Wuxi Lead Group, VGM of Wuxi Lead Laser Technology Co.,

Ltd.

11:00-11:15

High Reliability Microsystem Integration Technology for High Computing Power and

High Bandwidth Applications

Zongguang YU, Doctor, China Key System & Integrated Circuit Co., Ltd. Chief

Scientist of CETC/Rotating Chairman, Packaging & Testing Branch of CSIA

11:15-11:30 2.5D&3D Advanced Packaging Etching Technology Challenges and Solutions

Weitao Zhang, Beijing NAURA Microelectronics Equipment Co., Ltd.

The Product Director，BU ETCH I

20

11:30-11:45 Chiplet Packaging in IC Design: A Game-Changer

Ed Gu, MetaX Integrated Circuits (Shanghai) Co., Ltd., Director of Package & Chip

Supply Chain

11:45-12:00 Advanced packaging will help China chip make significant breakthrough

Dennies Ma, Huatian Technology (Kunshan) Electronics Co., Ltd, President of Research

Institute

12:00-13:30 Buffet Lunch

Moderator: Xia REN, Vice Secretary-General of CSIA, Packaging & Testing Branch

13:30-13:50 Latest Developments, Challenges and Opportunities of Chiplet technologies

Hong XIE, TongFu Microelectronics VP, General Manager of the Corporate

Engineering Center

13:50-14:10 Application of Optical Microscopy in Semiconductor Manufacturing

Xiao Ma, Shenzhen Glint Vision Co., Ltd

14:10-14:30 Chiplet integration trend in advanced Fan-out Packaging

David Wang, CRD, SPIL

14:30-14:50 Chip-Package-PCB Co-Design

David Wu, CEO of Shanghai RedEDA Co., Ltd.

14:50-15:10 AI-and-vision-fusion Solution and Application in Defect Inspection

Duojie Kuai, MEGAROBO Technologies, Technical Scientist

15:10-15:30 Networking Break

15:30-15:50 Diversified cost-optimized solutions for automotive electronics test handler

Guangman Lin, Shenzhen shenkeda Semiconductor Technology Co., Ltd

General Manager

15:50-16:10

Advanced inspection & measurement technologies help improving the yield during chip

manufacturing

Changli WU, R&D Director of Matrixtime Robotics Co., Ltd.

16:10-16:30 Dry Ice Cleaning Technology Introduction and Case Studies

Steven Su, Sales Director-China, Cold Jet Dry Ice Equipment (Shanghai) Co., Ltd.

21

16:30-16:50 Semiconductor dicing process and precision dispensing process to share

Yun ZHOU, Shenzhen Tensun Precision Equipment Co., Ltd.,

Semiconductor Precision Dicing BU Director

16:50-17:10 Adv. PKG Integration for Smart Computing Application

Yaojian LIN, JCET Group, VP

17:10-17:30 《Wafer Laser Etching Scheme Based on Semiconductor 3D Stacking Technology》

Chang CHEN, Shenzhen Han’s Semiconductor Equipment & Technology Co., LTD

17:30-17:50 Practice and thinking of innovation of advanced packaging technology

Daquan Yu, CEO of Xiamen Sky semiconductor Co., Ltd.

17:50-18:10

New Theory and New Method for the Interfacial Study of Electronic Packaging

Materials

Gi Xue, Nanjing University

18:15-20:30 Welcome Dinner

22

Session I: Innovation and Opportunities in Packaging/Testing & Process

Equipment

Oct.27th 09:00-16:55 Venue: International Hall 1, 7F

Moderator: Hua WU, Vice Secretary-General of China Semiconductor Industry Association,

Packaging & Testing Branch

09:00-09:25 Advanced Grinding Technology for A New Future

Jinlong Gao, JCA & Vice general manager

09:25-09:50 Failure Analysis of Electronics Products Subjected to HALT

Chiente Wu，ESPEC Environmental Equipment(Shanghai)Co., LTD., HALT/HASS

Applications Senior Engineer

09:50-10:15 Advances in Heterogenous Integration & C2W Hybrid Bonder

Eric, Chi WANG, SUZHOU ACCURACY ASSEMBLY AUTOMATION Co., Ltd,

Founder/Board Chairman

10:15-10:30 Networking Break

10:30-10:55 Applications of Bonding and Debonding in Semiconductor Package

Dr. YuCheng ChangSUZHOU IWISEETEC CO., LTD

10:55-11:20 YAMAHA 1 STOP SMART SOLUTION for Sintering

Eric LEE, Manager, Taiwan Office, PFA Corporation, YAMAHA Robotics Holding

11:20-11:45 Battery Management Systems (BMS) Device Testing and Trends for Automotive

Aik-Moh Ng, Product Manager, Teradyne

11:45-12:10 Fluxless TCB for Ultra-fine Pitch and Large Die Applications

Eric Zhao, Kulicke & Soffa Pte. Ltd., Regional Product Marketing Manager, Advance

Packaging

12:10-13:30 Buffet Lunch

Moderator: Dennies Ma, Huatian Technology (Kunshan) Electronics Co., Ltd, President of

Research Institute

13:30-13:55 SMEE Advanced Packaging Lithography Stepper Helps the Development of Chiplet

Technology

Douglas Huang, Vice GM of Shanghai Micro Electronics Equipment (Group) CO.,

LTD

13:55-14:20 Opportunities and Challenges for Memory Die Bonder

Xiaolong OuyangVice President, R&D Center of DongGuan Attach Point Intelligent

Equipment Co., Ltd

14:20-14:45 Study of 2.5D/3D Heterogeneous Integration Based on Advanced Packaging

Chengqian WANG, Deputy Director of China Key System & Integrated Circuit CO.,

LTD, Micro-Manufacture Department

23

14:45-15:10 Trends and Prospects of Heterogeneous Integrated Microsystem Technology Based on

Micro-Nano Interconnection

Leida CHEN，Vice General manager of Natural Integration Advanced Semiconductor

Technology Co.，Ltd.

15:10-15:25 Networking Break

15:25-15:50 Challenges and Applications of Advanced Packaging Technology

Jun LI, Technical Expert of Sky Chip Interconnection Technology Co., Ltd.

15:50-16:15 Advanced Die bonder Equipment: Empowering the Iteration and Innovation of

Advanced Packaging Technology in the Post Moore Era

Jason SONG, Vice president of Capcon Limited

16:15-16:55 Application of ISO26262 Vehicle Functional Safety System in the Automotive

Electronics Industry

Zongwei ZHANG, Head, Functional Safety Certification, Bureau Veritas China

END

24

Session Ⅱ: Innovation and Cooperation of Key Advanced packaging Materials

Oct.27th 09:00-17:05 Venue: International Hall 2, 7F

Moderator: Guohua ZHANG, Vice Secretary-General of CSIA, Packaging & Testing Branch

09:00-09:25 The opportunities and challenges of Advanced Packaging substrate

Xin GU, CEO of Zhongshan CCSC Co., LTD

09:25-09:50 Application of Curing Kinetics in Epoxy Molding Compound

LIU XIANG，R&D Manager of DOITECH Semiconductor Advanced Material Co.,

Ltd

09:50-10:15 New Progress in Copper Alloys for Semiconductor Lead Frames

Jason Zhang，Director, Technical Marketing Department of Boway Alloy Plate and

Strip Co., Ltd

10:15-10:30 Networking Break

10:30-10:55 Advanced Packaging Material Solutions Empowering Sustainable Development

Jing Zhang, Doctor, Head of Shanghai Innovation Center, Heraeus Electronics China

10:55-11:20 Current Development Status and Outlook of PhotoSensitive Polyimide Materials (PSPI)

in Domestic Market

Qingzhou Cui, R&D Director for Photoresist Materials, Jinan Shengquan New

Materials LTD.

11:20-11:45 Research Progress of Epoxy Molding Compound in Zhongke KEHUA

Shanxue Wang, Deputy General Manager, Jiangsu Zhongke KEHUA New Materials

Co., Ltd

12:00-13:30 Buffet Lunch

Moderator：Junfeng CHANG, Secretary General of SZSIA

13:30-13:55 The Challenge and Solution for Advanced Package Material

Tommy Zhang, Weldtone Technology Co., Ltd. Technical Service Director

13:55-14:20 Application of New Soldering Thermal Interface Materials in Advanced Packages

Leo HU, Indium Corporation, Senior Area Technical Manager - East China

14:20-14:45 ACCESS Advanced IC-Substrate Solutions

Simon CHAN, CEO of Zhuhai ACCESS Semiconductor Co., Ltd.

14:45-15:10 Introduction of semiconductor assembly material from Cluster Technology Co., Ltd.

Douhaku Kotaro, Cluster Technology Co., Ltd.

15:10-15:25 Networking Break

15:25-15:50 Power Semiconductor Packaging Paste Solutions

Norman WANG, PacTite Electronic Materials Co., Ltd. Chief Sales Officer

15:50-16:15 High reliability QFN packaging lead frame solution

25

Sidney Zhang, Ningbo Kangqiang Electronics Co., Ltd., Deputy General Manager of

ELF Division

16:15-16:40 Technical Development of Domestic Epoxy Molding Compound

Wei Tan, R&D Manager of Jiangsu HHCK Advanced Materials Co., Ltd

16:40-17:05 New material solutions for silicon carbide module packaging

Sean Chen, Deputy Senior Manager, Marketing & Sales of Sumitomo Bakelite

(Suzhou) Co., Ltd.

END

26

Session III: Automotive Electronic Chips and Power Compound

Semiconductor Packaging and Testing Technology

Session IV: Advanced Packaging and Testing Technology

Time: Oct.27th 09:00-17:05 Venue: International Hall 3, 7F

Moderator: Weidong LIU, Vice Secretary-General of CSIA, Packaging & Testing Branch

09:00-09:25 Technology and Quality control for Automotive Electronic Packaging

Xiaowei Guo, Technical Director of Huatian Technology Xi’an Co., Ltd

09:25-09:50

Domestic intelligent manufacturing software to assist in the digital and intelligent

upgrading of semiconductor packaging and testing factories

Wayne MA, Vice-general Manager, Semiconductor BG, GETECH

09:50-10:15

ZEISS microscopy solutions for advanced packaging failure analysis and process

optimization

Chengliang Huang，Carl Zeiss (Shanghai) Co., Ltd., BD Manager

10:15-10:30 Networking Break

10:30-10:55 Power semiconductor trends and test solutions of Advantest CREA

Junlin Wang, Advantest China, Business Development & Center of Expertise，Asia

10:55-11:20 Key Packaging Technologies for Silicon Carbide Power Module

Jet SUN, Director, Basic Semiconductor (Wuxi)Co., Ltd

11:20-11:45

Silicon Carbide Power Device Testing: from Development to Mass Production, from

Wafer to Application

Yuan GAO, Global Power Technology Co., Ltd., Inc., Director of Application and Test

Center

11:45-12:10 Characteristic package design and technology

Jue Wang，Sichuan Suining Lippxin Microelectronics CO.,LTD Marketing & RD

manager

12:10-13:30 Buffet Lunch

Moderator: Weidong LIU, Vice Secretary-General of CSIA, Packaging & Testing Branch

13:30-13:55

Application and Development Trends of Advanced Packaging in the Automotive

Industry

Johnson Zhang, JCET Auto BU, Director

13:55-14:20 Development of Advanced Packaging Process and Solution to Bubble Problem

Woody Jones, General Manager, Elead Technology Co., Ltd.

14:20-14:45 CIM Solution in Semiconductor Packing、Test ＆ Assembly Service

Anita Gu, Product Development Director of Semiconductor Division of Nanjing

DigiHua Intelligent Systems Co., Ltd.

27

14:45-15:10 Automotive Semiconductor Packaging – Market & Technology Dynamics

Jianmin LI, Packaging RnD Director, Amkor Assembly & Test (Shanghai) co. Ltd.

15:10-15:25 Networking Break

15:25-15:50 ThermoFisher Scientific Solution for Advanced Packaging R&D and Failure Analysis

Vincent Yang, ThermoFisher Scientific, Sales Development Manager

15:50-16:15 Beyond Moore: Chiplets and Advanced Heterogeneous Integration

Cheng-Tar Terry Wu, Director, Business Development Team, AVP,

Samsung Electronics

16:15-16:40 Development of IC Heterogeneous Integration Packaging Technology

Daping YAO, Jiangsu CAS Microelectronics Integration Technology Co., Ltd.,

Chairman & CEO

16:40-17:05 Moore Elite SiP Solution

MooreElite

END

28

Session V: Henkel Forum

Time: Oct. 27th 13:30-17:00 Venue: Exhibition hall 2, 8F

12:00-13:30 Lunch, registration

13:30-13:45 Opening Addresses

13:45-14:15 Henkel Automobile Semiconductor Materials Solution

14:15-14:45 Henkel High Thermal Conductivity Chip Bonding Solution

14:45-15:15 Henkel Material Solutions for Advanced Packaging Applications

15:15-15:45 Tea Break

15:45-16:15 Henkel Chip Adhesive Film Solution

16:15-17:00 Exchange and collection of souvenir materials

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