SHANGHAI ENERGY SAVING
上海節(jié)能 No.01
2024
ENERGY SAVING FORUM
SHANGHAI ENERGY CONSERVATION
上海節(jié)能 No.08
2018
節(jié)能論壇
of traditional and emerging techniques and fluids for electronics cooling［J］. Renewable and Sustainable Energy Reviews，2017，78：
821-833.
［5］Bulut, M., Kandlikar, S. G., & Sozbir, N. (2018). A Review of Vapor
Chambers. Heat Transfer Engineering, 1-23.
［6］S. G. Kandlikar,“Critical heat flux in subcooled flow boiling-an assessment of current understanding and future directions for research,”Multiphase Science and Technology, vol.13, no.3, pp. 207-232, 2001.
［7］X. Ji, J. Xu, and A. M. Abanda,“Copper foam based vapor chamber for
high heat flux dissipation,”Exp. Therm. Fluid Sci., vol.40, pp. 93-102,
2012.
［8］J. Wei, A. Chan, and D. Copeland,“Measurement of vapor chamber
performance［Heatsink Applications］,”IEEE, pp. 191-194, 2003.
［9］S.-C. Wong, K.-C. Hsieh, J.-D. Wu, et al.“A novel vapor chamber and
its performance,”Int. J. Heat Mass Transfer, vol. 53, no. 11-12, pp.
2377-2384, 2010.
［10］S. S. Kim, J. A. Weibel, T. S. Fisher, et al.“Thermal performance of
carbon nanotube enhanced vapor chamber wicks,”2010 14th International Heat Transfer Conference, Washington, D.C., pp. 417-424, 8-
13 August 2010.
［11］X. Ji, J. Xu, A. M. Abanda, et al.“A Vapor Chamber using extended
condenser concept for ultra high heat flux and large heater area,”Int.
J. Heat Mass Transfer, vol. 55, no. 17-18, pp. 4908-4913, 2012.
［12］Y.-T. Chen, J.-M. Miao, D.-Y. Ning, et al.“Thermal performance of a
vapor chamber heat pipe with diamond-copper composition wick
structures,”Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, 4th International, pp. 340-343, 21-23
Oct. 2009.
［13］H. R. Boukhanouf, and C. Buffone. in Advanced Computational Methods in Heat Transfer IX, pp. 270-279, ed. B. Sunden & C. A. Brebbia,
Southampton, UK, 2006.
［14］Boukhanouf, A. Haddad, M. T. North, et al.“Experimental investigation of a flat plate heat pipe performance using ir thermal imaging
camera,”Appl. Therm. Eng., vol. 26, no. 17-18, pp. 2148-2156, 2006.
［15］Xuan, Y. Hong, and Q. Li.“Investigation on Transient behaviors of
flat plate heat pipes,”Exp. Therm. Fluid Sci.,vol. 28, no. 2-3, pp.
249-255, 2004.
［16］S. Hwang, et al.“Multi-artery heat pipespreader: experiment,”Int. J.
Heat Mass Transfer, vol. 53, no.13-14, pp. 2662-2669, 2010.
［17］C. Wang, R.-T. Wang, T.-L. Chang, et al.“Development of 30 watt
high-power LEDs vapor chamber-based plate,”Int. J. Heat Mass
Transfer, vol. 53, no.19-20, pp. 3990-4001, 2010.
［18］Tang, D. Yuan, L. Lu, and Z. Wang, 2013,“A multi-artery vapor
chamber and its performance,”Appl. Therm. Eng., vol. 60, no. 1-2,
pp. 15-23, 2013.
［19］S. Hwang, et al. 2011,“Multi-artery heatpipe spreader: lateral liquid
supply,”Int. J. Heat Mass Transfer, vol. 54, pp. 2334-2340.
［20］S. Ju, et al.“Planar vapor chamber with hybrid evaporator wicks for
the thermal management of high-heat-flux and high-power optoelectronic devices,”Int. J. Heat Mass Transfer, vol. 60, pp. 163- 169,
2013.
［21］C. Wang, R.-T. Wang, T.-L. Chang, et al.“Development of 30 watt
high-powerLEDs vapor chamber-based plate,”Int. J. Heat Mass
Transfer, vol. 53, no. 19-20, pp. 3990-4001, 2010.
［22］T. Wang, J.-C. Wang, and T.-L. Chang.“Experimental analysis for
thermal performance of a vapor chamber applied to high-performance servers,”Journal of Marine Science and Technology, vol.19,
no.4, pp. 353-36, 2011.
［23］Wang, and G. P. Peterson.“Investigation of a novel flat heat pipe,”J.
Heat Transfer, vol. 127, no. 2, pp. 165-170, 2005.
［24］H. S. Obata, J. C. Fukushima, T. A. Alves, et al.“Experimental study
of a Cu-Mo Alloy vapor chamber,”MATEC Web Conference, vol.39,
p. 2001, 4 pages, 2016.
［25］Wei, S. Somasundaram, B. He, et al.“Experimental characterization
of si micropillar based evaporator for advanced vapor chambers,”
Electronics Packaging Technology Conference (EPTC), 2014 IEEE
16th, pp. 335-340, 2014.
［26］-C. Wong, S.-F. Huang, and K.-C. Hsieh.“Performance tests on a novel vapor chamber,” Appl.Therm. Eng., vol. 31, no. 10, pp.
1757-1762, 2011.
［27］J. S. Go.“Quantitative thermal performance evaluation of a cost-effective vapor chamber heat sink containing a metal-etched microwick
structure for advanced microprocessor cooling,”Sensor and Actuators A: Physical, vol.121, no. 2, pp. 549-556, 2005.
［28］S. Lips, F. Lefèvre, and J. Bonjour.“Nucleate boiling in a flat grooved
heat pipe,”Int. J.Therm. Sci., vol. 48, no. 7, pp. 1273-1278, 2009.
［29］Lefèvre, R. Rullière, S. Lips, et al.“Confocal microscopy for capillary film measurements in a flat plate heat pipe,”J. Heat Transfer,
vol. 132, no. 3, pp. 031502-1-6,
［30］S. Lips, F. Lefèvre, and J. Bonjour.“Physical mechanisms involved in
grooved flat heat pipes:experimental and numerical analyses,”Int. J.
Therm. Sci., vol. 50, no. 7, pp. 1243-1252, 2011.
［31］PAIVA K V D，MANTELLI B H M，SLONGO L K. Thermal behavior analysis of wire mini heat pipe［J］. Journal of Heat Transfer，
2011，133(12)：121502.
［32］DING C，SONI G，BOZORGI P，et al. A flat heat pipe architecture
based on nanostructured titania［J］. Journal of Microelectromechanical Systems，2010，19(4)：878-884.
［33］DENG D，HUANG Q，XIE Y，et al. Thermal performance of composite porous vapor chambers with uniform radial grooves［J］. Applied
Thermal Engineering，2017，125：1334-1344.
［34］CHEN L，DENG D，HUANG Q，et al. Development and thermal performance of a vapor chamber with multi-artery reentrant microchannels for high-power LED［J］. Applied Thermal Engineering，2020，
166：114686.
［35］王宙,銀了飛,丁藝,等.具有梯度結(jié)構(gòu)吸液芯的均熱板傳熱特性［J］.
工程熱物理學(xué)報,2023,44(2):532-539.
［36］SUN Zhen, CHEN Xiaodan, QIU Huihe. Experimental Investigation
of a Novel Asymmetric Heat Spreader With Nanostructure Surfaces
［J］. Experimental Thermal and Fluid Science, 2014, 52: 197-204.
［37］LI Yong, LI Zixi, ZHOU Wenjie, et al. Experimental Investigation of
Vapor Chambers with Difffferent Wick Structures at Various Parameters［J］, Experimental Thermal and Fluid Science. 2016, 77: 132-143.
［38］Min D H, Hwang G S, Kaviany M. Multi-artery, Heat pipe Spreader
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